325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V
SOT-23
M2S090-FCSG325I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
10 Weeks
Package / Case
325-TFBGA, CSPBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
325
Terminal Finish
MATTE TIN
Additional Feature
LG-MIN, WD-MIN
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
0.5mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B325
Number of Outputs
180
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Number of I/O
180
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
180
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes
FPGA - 90K Logic Modules
Number of Logic Cells
86316
Flash Size
512KB
Length
13.5mm
Height Seated (Max)
1.16mm
Width
11mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
176
$124.96682
$21994.16032
M2S090-FCSG325I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 90K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 180 I/Os.A power supply with a 1.2V rating is recommended.There is no safe voltage for the SoCs wireless above 1.26V.Power supply should be at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.It is really beneficial to have system on a chip since there are 325 terminations in total.Using this SoC chip, you have the option of having 180 outputs.There is 1.2V power supply required for system on chip.There are 180 inputs available on the SoC chip.86316 logic cells are present in logic system on chips.The flash is set to 512KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. LG-MIN, WD-MIN
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M2S090-FCSG325I System On Chip (SoC) applications.