-40°C~100°C TJ System On Chip SmartFusion®2 Series 387 I/O
SOT-23
M2S060-1FG676I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time
10 Weeks
Package / Case
676-BGA
Supplier Device Package
676-FBGA (27x27)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
387
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Primary Attributes
FPGA - 60K Logic Modules
Flash Size
256KB
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
40
$128.68500
$5147.4
M2S060-1FG676I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 676-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 387 I/Os.The flash is set to 256KB.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash.