This SoC is built on ARM® Cortex®-M3 core processor(s).

A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 676-BGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines FPGA - 60K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 387 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 676 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 387 outputs.In order to use system on chip, you will need a power supply of 1.2V.This SoC chip is equipped with 387 inputs for the user to choose from.The logic system on chips contain 56520 logic cells.This flash has a size of 256KB.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation

M2S060T-1FGG676 System On Chip (SoC) applications.

• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances
• Industrial automation devices
• Sports
• Fitness
• Healthcare