XC7Z030-1FFG676I

new-10%

Manufacturer part number:XC7Z030-1FFG676I

Manufacturer:Xilinx Inc.

Description:676 Terminations -40°C~100°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

Case Package:SOT-23

Datasheet:XC7Z030-1FFG676I Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Contact Plating	Copper, Silver, Tin
Package / Case	676-BBGA, FCBGA
Surface Mount	YES
Number of Pins	676
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Zynq®-7000
Published	2009
JESD-609 Code	e1
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of Terminations	676
ECCN Code	3A991.D
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	245
Supply Voltage	1V
Terminal Pitch	1mm
Frequency	667MHz
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	XC7Z030
Pin Count	676
Operating Supply Voltage	1V
Supply Voltage-Max (Vsup)	1.05V
Power Supplies	11.8V
Interface	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O	130
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Data Bus Width	32b
Core Architecture	ARM
Boundary Scan	YES
Speed Grade	-1
RAM (words)	256000
Primary Attributes	Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility	CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable	N
Length	27mm
Height Seated (Max)	3.24mm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant