-40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O
SOT-23
M2S060T-FCSG325I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
10 Weeks
Package / Case
325-TFBGA, CSPBGA
Supplier Device Package
325-CSPBGA (11x11)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
200
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Primary Attributes
FPGA - 60K Logic Modules
Flash Size
256KB
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
176
$88.38449
$15555.67024
M2S060T-FCSG325I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 200 I/Os.There is a flash of 256KB on it.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash.
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M2S060T-FCSG325I System On Chip (SoC) applications.