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M2S060T-FCSG325I

M2S060T-FCSG325I

M2S060T-FCSG325I

Microsemi Corporation

-40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O

SOT-23

M2S060T-FCSG325I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Supplier Device Package 325-CSPBGA (11x11)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 60K Logic Modules
Flash Size 256KB
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
176 $88.38449 $15555.67024
M2S060T-FCSG325I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 200 I/Os.There is a flash of 256KB on it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.


There are a lot of Microsemi Corporation


M2S060T-FCSG325I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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