This SoC is built on ARM® Cortex®-M3 core processor(s).

ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 676-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 60K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 387 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 676 terminations.A SoC chip like this can have 387 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 387 inputs that can be used.The logic SoC features 56520 logic cells.A flashing 256KB appears on it.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation

M2S060TS-1FGG676I System On Chip (SoC) applications.

• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances