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M2S090-1FG676

M2S090-1FG676

M2S090-1FG676

Microsemi Corporation

676 Terminations 0°C~85°C TJ M2S090 System On Chip SmartFusion®2 Series 425 I/O 1.2V

SOT-23

M2S090-1FG676 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 8 Weeks
Package / Case 676-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2009
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 425
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Length 27mm
Height Seated (Max) 2.44mm
Width 27mm
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
40 $196.84000 $7873.6
M2S090-1FG676 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 676-BGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 90K Logic Modules.Housed in the state-of-art Tray package.425 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 676 terminations in total and that really benefits system on a chip.You can have 425 user outputs for this SoC chip.System on chip requires 1.2V power supplies.425 inputs are available on the SoC chip.Logic system on chips features 86316 logic cells.It has a 512KB flash.You can get system on chips with similar specs and purposes by searching M2S090.The wireless SoC works at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S090-1FG676 System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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