676 Terminations -40°C~100°C TJ M2S090 System On Chip SmartFusion®2 Series 425 I/O 1.2V
SOT-23
M2S090-1FGG676I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
8 Weeks
Package / Case
676-BGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2009
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
676
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
1mm
Frequency
166MHz
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
M2S090
JESD-30 Code
S-PBGA-B676
Number of Outputs
425
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Interface
CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O
425
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
425
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Primary Attributes
FPGA - 90K Logic Modules
Number of Logic Cells
86316
Flash Size
512KB
Length
27mm
Height Seated (Max)
2.44mm
Width
27mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
40
$220.46075
$8818.43
M2S090-1FGG676I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 676-BGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.425 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 676 terminations, so system on a chip is really aided by this.There is the option to have 425 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 425.There are 86316 logic cells in the logic system on chips.The flash size of the SoC meaning is 512KB.A search for M2S090 will result in system on chips that have similar specs and purposes.A frequency of 166MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. Core Architecture: ARM
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M2S090-1FGG676I System On Chip (SoC) applications.