This SoC is built on ARM® Cortex®-M3 core processor(s).

A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 325-TFBGA, CSPBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 180.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 325 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 180 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 180 inputs is available to the user.86316 logic cells are included in logic system on chips.There is a flash of 512KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation

M2S090T-FCSG325I System On Chip (SoC) applications.

• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances
• Industrial automation devices
• Sports