This SoC is built on ARM® Cortex®-M3 core processor(s).

ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 676-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Automotive, AEC-Q100, SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~125°C TJ.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 425 I/Os.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A flashing 512KB appears on it.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation

M2S090TS-1FGG676T2 System On Chip (SoC) applications.

• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances