484 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 273 I/O 1.2V
SOT-23
M2S150-FCV484 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
12 Weeks
Package / Case
484-BFBGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
JESD-609 Code
e0
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
Terminal Finish
Tin/Lead (Sn/Pb)
Additional Feature
LG-MIN, WD-MIN
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
0.8mm
Reach Compliance Code
not_compliant
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B484
Number of Outputs
273
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Number of I/O
273
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
273
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes
FPGA - 150K Logic Modules
Number of Logic Cells
146124
Flash Size
512KB
Length
19mm
Height Seated (Max)
3.15mm
Width
19mm
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
84
$227.74917
$19130.93028
M2S150-FCV484 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BFBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 150K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 273 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 484 terminations in total.In order for this SoC chip to work properly, you can have 273 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 273 inputs.In logic system on chips, there are 146124 logic cells.As for its flash size, it is 512KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. LG-MIN, WD-MIN