MPF100T-1FCSG325I Overview

There are two packages that contain fpga chips: 324-LFBGA package and X package. A total of 170 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 109000 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 0.97V~1.08V , at which it runs. FPGAs belonging to the PolarFire? series are a type of FPGA that belong to the PolarFire? series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. A device like this one offers 7782400 RAM bits, which is a considerable amount of memory. Device package 325-FPGA (11x11) is provided by its supplier.

MPF100T-1FCSG325I Features

170 I/Os
Up to 7782400 RAM bits

MPF100T-1FCSG325I Applications

There are a lot of Microsemi Corporation MPF100T-1FCSG325I FPGAs applications.

• Artificial intelligence (AI)
• Wired Communications
• Integrating multiple SPLDs
• Medical Electronics
• Audio
• Device controllers
• Data center hardware accelerators
• Industrial IoT
• Voice recognition
• Solar Energy