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MPF100TLS-FCSG325I

MPF100TLS-FCSG325I

MPF100TLS-FCSG325I

Microsemi Corporation

FPGAs PolarFire? Series 324-LFBGA

SOT-23

MPF100TLS-FCSG325I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 324-LFBGA
Supplier Device Package 325-FPGA (11x11)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series PolarFire™
Part Status Active
Voltage - Supply 0.97V~1.08V
Number of I/O 170
Number of Logic Elements/Cells 109000
Total RAM Bits 7782400
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $309.53000 $309.53
MPF100TLS-FCSG325I Product Details

MPF100TLS-FCSG325I Overview


There are two packages that contain fpga chips: 324-LFBGA package and X package. 170 I/Os are available for transferring data more efficiently. A fundamental building block consists of 109000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. A supply voltage of 0.97V~1.08V is needed in order for fpga chips to operate. The PolarFire? Series is one of the types of FPGAs that belong to this type. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. In order to save space, this FPGA model has been contained in Tray. This device has 7782400 RAM bits, which is the number of RAM bits that this device offers. The device package supplied by 325-FPGA (11x11) is one of its suppliers.

MPF100TLS-FCSG325I Features


170 I/Os
Up to 7782400 RAM bits

MPF100TLS-FCSG325I Applications


There are a lot of Microsemi Corporation MPF100TLS-FCSG325I FPGAs applications.

  • Software-defined radio
  • Defense Applications
  • Video & Image Processing
  • Voice recognition
  • Consumer Electronics
  • Filtering and communication encoding
  • Medical imaging
  • Data Mining
  • OpenCL
  • Wired Communications

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