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MPF300TLS-FCG1152I

MPF300TLS-FCG1152I

MPF300TLS-FCG1152I

Microsemi Corporation

FPGAs PolarFire? Series 1152-BBGA, FCBGA

SOT-23

MPF300TLS-FCG1152I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series PolarFire™
Part Status Active
Voltage - Supply 0.97V~1.08V
Number of I/O 512
Number of Logic Elements/Cells 300000
Total RAM Bits 21094400
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $628.99000 $628.99
MPF300TLS-FCG1152I Product Details

MPF300TLS-FCG1152I Overview


A 1152-BBGA, FCBGA package is provided with this component. A total of 512 I/Os allow data to be transferred in a more coherent manner. To form a fundamental building block, there are 300000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. There is a 0.97V~1.08V-volt supply voltage required for the device to operate. There are many types of FPGAs in the PolarFire? series, this is one of them. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 21094400. It employs 1152-FCBGA (35x35) as its supplier device package.

MPF300TLS-FCG1152I Features


512 I/Os
Up to 21094400 RAM bits

MPF300TLS-FCG1152I Applications


There are a lot of Microsemi Corporation MPF300TLS-FCG1152I FPGAs applications.

  • Video & Image Processing
  • Software-defined radio
  • Defense Applications
  • Audio
  • ASIC prototyping
  • Filtering and communication encoding
  • Digital signal processing
  • Medical Applications
  • Random logic
  • Broadcast

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