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MPF300TS-1FCG784I

MPF300TS-1FCG784I

MPF300TS-1FCG784I

Microsemi Corporation

FPGAs PolarFire? Series 784-BBGA, FCBGA

SOT-23

MPF300TS-1FCG784I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 784-BBGA, FCBGA
Supplier Device Package 784-FCBGA (29x29)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series PolarFire™
Part Status Active
Voltage - Supply 0.97V~1.08V
Number of I/O 388
Number of Logic Elements/Cells 300000
Total RAM Bits 21094400
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $571.81000 $571.81
MPF300TS-1FCG784I Product Details

MPF300TS-1FCG784I Overview


The package that contains this software is called 784-BBGA, FCBGA. This device features 388 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 300000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. With a supply voltage of 0.97V~1.08V, this device operates with ease. As part of the PolarFire? series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 21094400 bFpga chipss. It employs 784-FCBGA (29x29) as its supplier device package.

MPF300TS-1FCG784I Features


388 I/Os
Up to 21094400 RAM bits

MPF300TS-1FCG784I Applications


There are a lot of Microsemi Corporation MPF300TS-1FCG784I FPGAs applications.

  • Space Applications
  • Enterprise networking
  • Secure Communication
  • Solar Energy
  • Data center search engines
  • Audio
  • Wireless Communications
  • Aerospace and Defense
  • Integrating multiple SPLDs
  • Industrial IoT

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