U1AFS1500-FGG256 Overview

In the 256-LBGA package, you will find fpga chips. The device has 119 I/O ports for more coherent data transfer. The Surface Mount-slot on the development board allows you to attach the FPGA module. This device is powered by a 1.425V~1.575V battery. An FPGA belonging to the Fusion? series is referred to as an FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that are offered by this fpga chips are 276480. Its base part number U1AFS1500 can be used to find related parts. The FPGA module's RAM si33.8kBe reaches 33.8kB in order to ensure that the program operates in a normal manner. 256 pins are designed into the device. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. A maximum operating temperature of 85°C can be reached by this module. The operating temperature should be higher than 0°C. Fpga semiconductor is made up of 1500000 gates as fpga semiconductors basic building block. This device package is supplied by 256-FPBGA (17x17).

U1AFS1500-FGG256 Features

119 I/Os
Up to 276480 RAM bits
256 LABs/CLBs
85°C gates

U1AFS1500-FGG256 Applications

There are a lot of Microsemi Corporation U1AFS1500-FGG256 FPGAs applications.

• Server Applications
• Development Boards and Shields for Microcontrollers
• Ecosystem
• Industrial IoT
• Embedded Vision
• Secure Communication
• DO-254
• Medical ultrasounds
• Integrating multiple SPLDs
• Wireless Communications