U1AFS1500-FGG256I Overview

There are two packages that contain fpga chips: 256-LBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 119 I/Os are programmed to ensure a more coherent data transfer. 1.5V volts power it. This FPGA module can be attached to the development board with a Surface Mount. Powered by a 1.425V~1.575V supply voltage, fpga chips is able to operate at high speeds. As part of the Fusion? series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. In order to save space, this FPGA model has been contained in Tray. Total terminations are 256. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 276480 bFpga chipss. In order to find related parts, use the part number U1AFS1500 as a base. The FPGA module's RAM si33.8kBe reaches 33.8kB in order to ensure that the program operates in a normal manner. Fpga electronics is designed wfpga electronics h 256 pins. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. The basic building block of this system consists of 1500000 gates. Its architecture is based on 38400 CLBs.

U1AFS1500-FGG256I Features

119 I/Os
Up to 276480 RAM bits
256 LABs/CLBs

U1AFS1500-FGG256I Applications

There are a lot of Microsemi Corporation U1AFS1500-FGG256I FPGAs applications.

• High Performance Computing
• Aerospace and Defense
• Industrial Ethernet
• Artificial intelligence (AI)
• Automation
• Integrating multiple SPLDs
• Embedded Vision
• Video & Image Processing
• Data Center
• Wireless Communications