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173-E37-211-001

173-E37-211-001

173-E37-211-001

NorComp Inc.

173-E Series D-Sub Receptacle, Female Sockets 37-Position Female Signal Solder 4 DC C Panel Mount, Through Hole, Right Angle Bronze Gold Steel, Yellow Chromate Plated

SOT-23

173-E37-211-001 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Material Bronze
Contact Plating Gold
Mount Through Hole
Mounting Type Panel Mount, Through Hole, Right Angle
Dielectric Material Polybutylene Terephthalate (PBT)
Housing Material PBT
Shell Material, Finish Steel, Yellow Chromate Plated
Operating Temperature -50°C~100°C
Published 2002
Series 173-E
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 37
Max Operating Temperature 100°C
Min Operating Temperature -50°C
Color White
Number of Rows 2
Gender Female
Contact Type Signal
Current Rating (Amps) 5A
Current Rating 5A
Contact Finish Gold
Housing Color White
Flange Feature Housing/Shell (Unthreaded)
Connector Style D-Sub
Contact Form Machined
Shell Size, Connector Layout 4 DC C
Backset Spacing 0.283 (7.20mm)
Height 12.6mm
Length 69.3mm
Contact Finish Thickness Flash
Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
173-E37-211-001 Product Details

173-E37-211-001 Overview


This product is packaged in a Receptacle, Female Sockets cartonPanel Mount, Through Hole, Right Angle is the mounting type of the device.This is from the 173-E Series.The ideal temperature for using it is below 100°C.There must be a minimum temperature of -50°C for this device to operate.Part Through Hole is mounted to the part.It operates at an operating temperature of -50°C~100°C.

173-E37-211-001 Features


173-E series

173-E37-211-001 Applications


There are a lot of NorComp Inc. 173-E37-211-001 D-Sub Connectors applications.

  • Industrial Automation
  • Blowers
  • Military Technology
  • Instrumentation
  • Transportation
  • Telecommunications
  • Electrical substations
  • Embedded systems
  • Refrigeration control
  • Anywhere power is distributed

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