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KMC68MH360ZP33L

KMC68MH360ZP33L

KMC68MH360ZP33L

NXP USA Inc.

CPU32+ Microprocessor M683xx Series MC68MH360 357-BGA

SOT-23

KMC68MH360ZP33L Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 357-BGA
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1998
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68MH360
Speed 33MHz
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant
KMC68MH360ZP33L Product Details

KMC68MH360ZP33L Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. In the M683xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces SCC, SMC, SPI for better service. At 5.0V, the CPU runs its I/O. Search MC68MH360 for variants of the embedded microprocessor.

KMC68MH360ZP33L Features


CPU32+ Core


KMC68MH360ZP33L Applications


There are a lot of NXP USA Inc.
KMC68MH360ZP33L Microprocessor applications.


  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio

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