PowerPC Microprocessor MPC7xx Series MC755 360-BBGA, FCBGA
SOT-23
KMC755CVT400LE Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
360-BBGA, FCBGA
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC7xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MC755
Speed
400MHz
Core Processor
PowerPC
Voltage - I/O
2.5V 3.3V
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$142.64000
$142.64
KMC755CVT400LE Product Details
KMC755CVT400LE Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 360-BBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~105°C TA. In the MPC7xx series, it is found. The CPU is cored by a processor with a number of 0 cores. At 2.5V 3.3V, the CPU runs its I/O. Search MC755 for variants of the embedded microprocessor.
KMC755CVT400LE Features
PowerPC Core
KMC755CVT400LE Applications
There are a lot of NXP USA Inc. KMC755CVT400LE Microprocessor applications.