PowerPC e300c3 Microprocessor MPC83xx Series MPC8313 516-BBGA Exposed Pad
SOT-23
KMPC8313ZQAFFB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
516-BBGA Exposed Pad
Supplier Device Package
516-TEPBGA (27x27)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC83xx
Published
2008
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8313
Speed
333MHz
Core Processor
PowerPC e300c3
Voltage - I/O
1.8V 2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, DDR2
USB
USB 2.0 + PHY (1)
Additional Interfaces
DUART, HSSI, I2C, PCI, SPI
RoHS Status
ROHS3 Compliant
KMPC8313ZQAFFB Product Details
KMPC8313ZQAFFB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 516-BBGA Exposed Pad. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~105°C TA. The cpu microprocessor belongs to the MPC83xx series. The CPU is cored with a PowerPC e300c3 processor. The CPU uses DDR, DDR2 RAM controllers. This microprocessor features interfaces DUART, HSSI, I2C, PCI, SPI. In this CPU, I/O is set to 1.8V 2.5V 3.3V. The microprocessor can be searched for with MPC8313 if you are looking for variants. Suppliers offer a package of 516-TEPBGA (27x27).
KMPC8313ZQAFFB Features
PowerPC e300c3 Core
KMPC8313ZQAFFB Applications
There are a lot of NXP USA Inc. KMPC8313ZQAFFB Microprocessor applications.