PowerPC e500 Microprocessor MPC85xx Series MPC8555 783-BBGA, FCBGA
SOT-23
KMPC8555EVTAPF Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
783-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC85xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8555
Speed
833MHz
Core Processor
PowerPC e500
Voltage - I/O
2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM, Security; SEC
Security Features
Cryptography, Random Number Generator
RoHS Status
ROHS3 Compliant
KMPC8555EVTAPF Product Details
KMPC8555EVTAPF Overview
The embedded microprocessor has been packed in 783-BBGA, FCBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around 0°C~105°C TA is determined. This is a member of the MPC85xx series. With a core count of PowerPC e500, this CPU is multicore. A CPU with this architecture uses DDR, SDRAM RAM controllers. With its DUART, I2C, PCI, SPI, TDM, UART interfaces, this microprocessor will be able to serve you better. The CPU runs at 2.5V 3.3V when it comes to I/O. Use MPC8555 when searching for variants of the embedded microprocessor. Suppliers are offering 783-FCPBGA (29x29) packages.
KMPC8555EVTAPF Features
PowerPC e500 Core
KMPC8555EVTAPF Applications
There are a lot of NXP USA Inc. KMPC8555EVTAPF Microprocessor applications.