PowerPC e500 Microprocessor MPC85xx Series MPC8560 784-BBGA, FCBGA
SOT-23
KMPC8560PX667LB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
784-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC85xx
Published
2002
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8560
Speed
667MHz
Core Processor
PowerPC e500
Voltage - I/O
2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, SDRAM
Additional Interfaces
I2C, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
KMPC8560PX667LB Product Details
KMPC8560PX667LB Overview
The embedded microprocessor ships overseas conveniently packed in 784-BBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around 0°C~105°C TA. MPC85xx is its series number. Core-wise, this CPU has a PowerPC e500 processor. It has DDR, SDRAM RAM controllers. A I2C, PCI, RapidIO, SPI, TDM, UART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 2.5V 3.3V. To find variants of the microprocessor, try searching with MPC8560. There is a 783-FCPBGA (29x29) package offered by suppliers.
KMPC8560PX667LB Features
PowerPC e500 Core
KMPC8560PX667LB Applications
There are a lot of NXP USA Inc. KMPC8560PX667LB Microprocessor applications.