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XPC850DECVR50BU

XPC850DECVR50BU

XPC850DECVR50BU

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BBGA

SOT-23

XPC850DECVR50BU Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 256-BBGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $35.71200 $2142.72
XPC850DECVR50BU Product Details

XPC850DECVR50BU Overview


The embedded microprocessor has been packed in 256-BBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -40°C~95°C TA is determined. This is a member of the MPC8xx series. A CPU with this architecture uses DRAM RAM controllers. With its HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. The CPU runs at 3.3V when it comes to I/O. Use PC850 when searching for variants of the embedded microprocessor.

XPC850DECVR50BU Features




XPC850DECVR50BU Applications


There are a lot of NXP USA Inc.
XPC850DECVR50BU Microprocessor applications.


  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products

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