PowerPC e500 Microprocessor MPC85xx Series MPC8560 784-BBGA, FCBGA
SOT-23
KMPC8560PX667LC Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
784-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC85xx
Published
2002
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8560
Speed
667MHz
Core Processor
PowerPC e500
Voltage - I/O
2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, SDRAM
Additional Interfaces
I2C, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
KMPC8560PX667LC Product Details
KMPC8560PX667LC Overview
Packed in 784-BBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~105°C TA. It comes from the MPC85xx series. This CPU is cored with a PowerPC e500 processor. This CPU uses DDR, SDRAM RAM controllers. To serve better this microprocessor features I2C, PCI, RapidIO, SPI, TDM, UART interfaces. This CPU runs I/O at 2.5V 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC8560. 783-FCPBGA (29x29) package is offered by suppliers.
KMPC8560PX667LC Features
PowerPC e500 Core
KMPC8560PX667LC Applications
There are a lot of NXP USA Inc. KMPC8560PX667LC Microprocessor applications.