LS101MASE7DFA Overview

Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 448-FBGA Exposed Pad. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. In the QorlQ LS1 series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DDR2 RAM controllers are used by this CPU. The microprocessor features interfaces I2C, PCIe, PCM/TDM, SPI, UART for better service. It is offered by suppliers as a package 448-PBGA w/Heat Spreader (23x23).

LS101MASE7DFA Features

ARM1136JF-S Core

LS101MASE7DFA Applications

There are a lot of NXP USA Inc.
LS101MASE7DFA Microprocessor applications.

• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine
• Microwave ovens
• Home appliances
• Home video and audio