ARM1136JF-S Microprocessor QorlQ LS1 Series 448-FBGA Exposed Pad
SOT-23
LS101MASN7DFA Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
448-FBGA Exposed Pad
Supplier Device Package
448-PBGA w/Heat Spreader (23x23)
Operating Temperature
0°C~70°C TA
Packaging
Tray
Series
QorlQ LS1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
650MHz
Core Processor
ARM1136JF-S
Ethernet
GbE (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR2
USB
USB 2.0 + PHY (1)
Additional Interfaces
I2C, PCIe, PCM/TDM, SPI, UART
RoHS Status
ROHS3 Compliant
LS101MASN7DFA Product Details
LS101MASN7DFA Overview
The microprocessor is conveniently packaged in 448-FBGA Exposed Pad, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around 0°C~70°C TA. The QorlQ LS1 series contains it. A ARM1136JF-S processor powers this CPU. DDR2 RAM controllers are used by this CPU. This microprocessor has I2C, PCIe, PCM/TDM, SPI, UART interfaces to serve you better. Suppliers offer a 448-PBGA w/Heat Spreader (23x23) package.
LS101MASN7DFA Features
ARM1136JF-S Core
LS101MASN7DFA Applications
There are a lot of NXP USA Inc. LS101MASN7DFA Microprocessor applications.