ARM® Cortex®-A7 Microprocessor QorIQ® Layerscape Series 525-FBGA, FCBGA
SOT-23
LS1022AXE7EKB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Package / Case
525-FBGA, FCBGA
Operating Temperature
-40°C~105°C
Packaging
Tray
Series
QorIQ® Layerscape
Published
2002
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
600MHz
Core Processor
ARM® Cortex®-A7
Ethernet
GbE (2)
Number of Cores/Bus Width
2 Core 32-Bit
RAM Controllers
DDR3L, DDR4
USB
USB 2.0 (1)
Co-Processors/DSP
Multimedia; NEON™ SIMD
Security Features
Secure Boot, TrustZone®
SATA
SATA 3Gbps (1)
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
84
$32.09595
$2696.0598
LS1022AXE7EKB Product Details
LS1022AXE7EKB Overview
The embedded microprocessor ships overseas conveniently packed in 525-FBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tray. In the CPU, there are 2 Core 32-Bit cores and 2 Core 32-Bit bus width. It is important to understand the operating temperature around -40°C~105°C. QorIQ® Layerscape is its series number. Core-wise, this CPU has a ARM® Cortex®-A7 processor. It has DDR3L, DDR4 RAM controllers.
LS1022AXE7EKB Features
ARM® Cortex®-A7 Core
LS1022AXE7EKB Applications
There are a lot of NXP USA Inc. LS1022AXE7EKB Microprocessor applications.