ARM1136JF-S Microprocessor QorlQ LS1 Series 448-FBGA Exposed Pad
SOT-23
LS102MASN7EHA Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
448-FBGA Exposed Pad
Supplier Device Package
448-PBGA w/Heat Spreader (23x23)
Operating Temperature
0°C~70°C TA
Packaging
Tray
Series
QorlQ LS1
Published
2014
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
650MHz
Core Processor
ARM1136JF-S
Ethernet
GbE (2)
Number of Cores/Bus Width
2 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR2
USB
USB 2.0 + PHY (1)
Additional Interfaces
I2C, PCIe, PCM/TDM, SPI, UART
RoHS Status
ROHS3 Compliant
LS102MASN7EHA Product Details
LS102MASN7EHA Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 448-FBGA Exposed Pad. High reliability is achieved using advanced packaging method Tray. 2 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. In the QorlQ LS1 series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DDR2 RAM controllers are used by this CPU. The microprocessor features interfaces I2C, PCIe, PCM/TDM, SPI, UART for better service. It is offered by suppliers as a package 448-PBGA w/Heat Spreader (23x23).
LS102MASN7EHA Features
ARM1136JF-S Core
LS102MASN7EHA Applications
There are a lot of NXP USA Inc. LS102MASN7EHA Microprocessor applications.