MC33FS4500LAE Overview

It is acceptable to ship using the method Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method is universal for easy adaptation.The power management is designed for use with applications at System Basis Chip .Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.The power management operates at a voltage of 1V~5V volts.

MC33FS4500LAE Features

Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4500LAE Applications

There are a lot of NXP USA Inc. MC33FS4500LAEPower Management applications.

• Docking station
• Networking Equipment
• Modules With Remote-Sense Capability
• Servers
• Storage Systems
• Supplement In-Circuit Tester (ICT) Access
• Automotive display
• WOA
• Digital Signage
• Industrial PC