CPU32+ Microprocessor M683xx Series MC68MH360 357-BBGA
SOT-23
MC68MH360ZQ25L Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
0°C~70°C TA
Packaging
Tray
Series
M683xx
Published
1997
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MC68MH360
Speed
25MHz
Core Processor
CPU32+
Voltage - I/O
5.0V
Ethernet
10Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
SCC, SMC, SPI
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
MC68MH360ZQ25L Product Details
MC68MH360ZQ25L Overview
Packed in 357-BBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~70°C TA. It comes from the M683xx series. This CPU is cored with a CPU32+ processor. This CPU uses DRAM RAM controllers. To serve better this microprocessor features SCC, SMC, SPI interfaces. This CPU runs I/O at 5.0V. If you are looking for variants of the cpu microprocessor, try search with MC68MH360. 357-PBGA (25x25) package is offered by suppliers.
MC68MH360ZQ25L Features
CPU32+ Core
MC68MH360ZQ25L Applications
There are a lot of NXP USA Inc. MC68MH360ZQ25L Microprocessor applications.