Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around -40°C~95°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search MC860 for variants of the embedded microprocessor.
MC860DECZQ50D4R2 Features
MC860DECZQ50D4R2 Applications
There are a lot of NXP USA Inc. MC860DECZQ50D4R2 Microprocessor applications.