MCIMX6D5EYM12AE

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Manufacturer part number:MCIMX6D5EYM12AE

Manufacturer:NXP USA Inc.

Description:0.8mm ARM® Cortex®-A9 Microprocessor i.MX6D Series 624-LFBGA, FCBGA

Case Package:SOT-23

Datasheet:MCIMX6D5EYM12AE Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	15 Weeks
Package / Case	624-LFBGA, FCBGA
Surface Mount	YES
Operating Temperature	-20°C~105°C TJ
Packaging	Tray
Series	i.MX6D
Published	2002
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	624
ECCN Code	5A992
HTS Code	8542.31.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Terminal Pitch	0.8mm
Time@Peak Reflow Temperature-Max (s)	40
JESD-30 Code	S-PBGA-B624
Supply Voltage-Max (Vsup)	1.5V
Supply Voltage-Min (Vsup)	1.275V
Speed	1.2GHz
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR
Core Processor	ARM® Cortex®-A9
Address Bus Width	16
Boundary Scan	YES
Low Power Mode	YES
External Data Bus Width	64
Format	FIXED POINT
Integrated Cache	YES
Voltage - I/O	1.8V 2.5V 2.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (4)
Additional Interfaces	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers	Keypad, LCD
SATA	SATA 3Gbps (1)
Length	21mm
Height Seated (Max)	1.6mm
RoHS Status	ROHS3 Compliant