25, 14 Bit 1:1, 1:2 Configurable Registered Buffer with Parity 1.8V 0°C~70°C Specialty Logic IC 74SSTUH32866 0.8mm 1.7V~1.9V 96-LFBGA
SOT-23
SSTUH32866EC,557 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
96-LFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2005
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
96
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
240
Number of Functions
1
Supply Voltage
1.7V~1.9V
Terminal Pitch
0.8mm
Reach Compliance Code
unknown
Time@Peak Reflow Temperature-Max (s)
20
Base Part Number
74SSTUH32866
Pin Count
96
JESD-30 Code
R-PBGA-B96
Qualification Status
Not Qualified
Power Supplies
1.8V
Number of Bits
25, 14
Logic Type
1:1, 1:2 Configurable Registered Buffer with Parity
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
1.8 ns
fmax-Min
450 MHz
Height Seated (Max)
1.5mm
Length
13.5mm
Width
5.5mm
RoHS Status
ROHS3 Compliant
SSTUH32866EC,557 Product Details
SSTUH32866EC,557 Overview
Packing is accomplished by using Tray.You can find it in the 96-LFBGA package.Providing a voltage of 1.7V~1.9V ensures proper function of the device.Electronic parts mounted in the way of Surface Mount are referred to as this type.An operating temperature of 0°C~70°C has been set for the device.Memory has a bit size of 25, 14.On the basis of its base part number 74SSTUH32866, several related parts can be found.The total number of pins on the component is 96.In 96 terminations, signals are prevented from reflecting off the end of the transmission line.The item falls under the Other Logic ICs subcategory.Maintaining the power supplies of 1.8V is essential for convenient operation.
SSTUH32866EC,557 Features
SSTUH32866EC,557 Applications
There are a lot of NXP USA Inc. SSTUH32866EC,557 Specialty Logic ICs applications.