28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUM32865 0.65mm 1.7V~2V 160-TFBGA
SOT-23
SSTUM32865ET/G,518 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
160-TFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tape & Reel (TR)
Published
2007
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
160
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.7V~2V
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
74SSTUM32865
Pin Count
160
JESD-30 Code
R-PBGA-B160
Qualification Status
Not Qualified
Number of Bits
28
Output Characteristics
OPEN-DRAIN
Logic Type
1:2 Registered Buffer with Parity
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
1.4 ns
fmax-Min
450 MHz
Length
13mm
Height Seated (Max)
1.15mm
Width
9mm
RoHS Status
ROHS3 Compliant
SSTUM32865ET/G,518 Product Details
SSTUM32865ET/G,518 Overview
As a packaging method, Tape & Reel (TR) is used.The 160-TFBGA package contains it.To ensure normal operation of the device, 1.7V~2V is supplied.A Surface Mount mounting method is used for mounting electronic parts.The operating temperature is set to 0°C~70°C.Information is stored in the memory with a size of 28 bits.Based on its base part number 74SSTUM32865, related parts can be found.All component pins add up to 160.The 160 terminations prevent signals from reflecting off the end of the transmission line.
SSTUM32865ET/G,518 Features
SSTUM32865ET/G,518 Applications
There are a lot of NXP USA Inc. SSTUM32865ET/G,518 Specialty Logic ICs applications.