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XC56L307VL160

XC56L307VL160

XC56L307VL160

NXP USA Inc.

CPLD DSP563xx Series XC56L307 196-LBGA

SOT-23

XC56L307VL160 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-MAPBGA (15x15)
Operating Temperature -40°C~100°C
Packaging Tray
Series DSP563xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number XC56L307
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
Voltage - Core 1.80V
On Chip Data RAM 576kB
Clock Rate 160MHz
RoHS Status ROHS3 Compliant
XC56L307VL160 Product Details

XC56L307VL160 Overview


It is a type of electronic component available in package 196-LBGA.The packaging way is Tray.In addition to meeting a wide range of requirements, it is a member of Fixed Point.Surface Mount is the direction in which it is mounted.The operation of the device at the temperature of -40°C~100°C ensures the normal operation of the device.The analog voltage range of 3.30V refers to the input or output voltage.The DSP563xx series contains this digital signal processor.With its base part number XC56L307, it is possible to identify a number of related parts.

XC56L307VL160 Features


Supplied in the 196-LBGA package

XC56L307VL160 Applications


There are a lot of NXP USA Inc. XC56L307VL160 DSP applications.

  • Statistical signal processing
  • Airplanes
  • Vehicle electronics
  • Boats
  • Biometrics
  • Audio compression
  • Fourier transform
  • Other sensor array processing
  • Streaming music
  • Instrument modeling

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