XPC8255CVVIFBC Overview

With a packing size of 480-LBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~105°C TA. A MPC82xx series item. A PowerPC G2 processor is present in this CPU. The CPU contains DRAM, SDRAM RAM controllers. This microprocessor is equipped with an interface of I2C, SCC, SMC, SPI, UART, USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with PC8255. A supplier offers a 480-TBGA (37.5x37.5) package.

XPC8255CVVIFBC Features

PowerPC G2 Core

XPC8255CVVIFBC Applications

There are a lot of NXP USA Inc.
XPC8255CVVIFBC Microprocessor applications.

• Radio
• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine
• Microwave ovens
• Home appliances