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XPC850DEVR50BU

XPC850DEVR50BU

XPC850DEVR50BU

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BBGA

SOT-23

XPC850DEVR50BU Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 256-BBGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $33.07200 $1984.32
XPC850DEVR50BU Product Details

XPC850DEVR50BU Overview


The embedded microprocessor ships overseas conveniently packed in 256-BBGA. A high level of reliability is provided by using an advanced packaging method Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around 0°C~95°C TA. MPC8xx is its series number. It has DRAM RAM controllers. A HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 3.3V. To find variants of the microprocessor, try searching with PC850.

XPC850DEVR50BU Features




XPC850DEVR50BU Applications


There are a lot of NXP USA Inc.
XPC850DEVR50BU Microprocessor applications.


  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine

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