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XPC850DEZT66BU

XPC850DEZT66BU

XPC850DEZT66BU

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BGA

SOT-23

XPC850DEZT66BU Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant
XPC850DEZT66BU Product Details

XPC850DEZT66BU Overview


Packed in 256-BGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~95°C TA. It comes from the MPC8xx series. This CPU uses DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. This CPU runs I/O at 3.3V. If you are looking for variants of the cpu microprocessor, try search with PC850.

XPC850DEZT66BU Features




XPC850DEZT66BU Applications


There are a lot of NXP USA Inc.
XPC850DEZT66BU Microprocessor applications.


  • Measurement and control field
  • Automatic control
  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan

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