OSD32MP157C-512M-BAA-ES datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Octavo Systems LLC stock available on our website
SOT-23
OSD32MP157C-512M-BAA-ES Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
8 Weeks
Operating Temperature
0°C~85°C
Series
OSD32MP15x
Size / Dimension
0.709 x 0.709 18mmx18mm
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Connector Type
302-BGA
Speed
650MHz, 209MHz
RAM Size
512MB
Core Processor
Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Module/Board Type
MPU Core
Co-Processor
NEON™ SIMD
RoHS Status
ROHS3 Compliant
OSD32MP157C-512M-BAA-ES Product Details
OSD32MP157C-512M-BAA-ES Overview
A MPU Core module or board is used in the microcontroller.An integral MCU electronics of it is a processor with Arm? Dual Cortex?-A7, Arm? Cortex?-M4 cores that drives the whole thing.Microcontrollers are configured by default to 0°C~85°C.Connector type 302-BGA refers to the type of connector.MCU chip belongs to the OSD32MP15x Series.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 512MB.In this case, the MCU chip operates at a 650MHz, 209MHz speed.Microprocessor chip is powered by a NEON? SIMD Core Processor.
OSD32MP157C-512M-BAA-ES Features
Core processor of Arm? Dual Cortex?-A7, Arm? Cortex?-M4 Speed of 650MHz, 209MHz
OSD32MP157C-512M-BAA-ES Applications
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