FAN73893MX Overview

In order to increase flexibility, the package 28-SOIC (0.295, 7.50mm Width) is used.Tape & Reel (TR) represents the packaging method.For its configuration, it incorporates 6 drivers.The device is mounted in the direction of Surface Mount.In the absence of a 10V~20V supply voltage, its superiority can be demonstrated.A gate type of IGBT, N-Channel MOSFET is used in its design.For this device, the temperature range is -40°C~150°C TJ.Inverting is used as the input type in this program.The device is mounted using Surface Mount.As a result, it is configured with 28 pins when it is designed.Mosfet driver is possible to achieve a maximum output current of 650mA.High-side voltage - Max (Bootstrap) can be as low as 600V.Having the maximum power dissipation of 1.4W indicates its maximum capacity to conduct power losses without overheating.To ensure high stability, the supply current should be kept at 750μA.

FAN73893MX Features

Embedded in the Tape & Reel (TR) package
6 drivers
Employing a gate type of IGBT, N-Channel MOSFET
28 pins
High-side voltage - Max (Bootstrap) of 600V
Maximum power dissipation of 1.4W

FAN73893MX Applications

There are a lot of ON Semiconductor FAN73893MX gate drivers applications.

• Active Clamp Flyback or Forward and Synchronous Rectifier
• Commercial air-conditioning (CAC)
• Pulse transformer drivers
• High power buffers
• Industrial Modules
• Topologies
• Portable computers
• High frequency line drivers
• High-voltage isolated DC-DC converters
• Dual-Battery Systems