FDC6303N datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website
SOT-23
FDC6303N Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
SOT-23-6 Thin, TSOT-23-6
Number of Pins
6
Weight
36mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1997
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
Termination
SMD/SMT
ECCN Code
EAR99
Resistance
450mOhm
Terminal Finish
Tin (Sn)
Additional Feature
LOGIC LEVEL COMPATIBLE
Subcategory
FET General Purpose Power
Voltage - Rated DC
25V
Max Power Dissipation
900mW
Terminal Form
GULL WING
Current Rating
680mA
Number of Elements
2
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
900mW
Turn On Delay Time
3 ns
Power - Max
700mW
FET Type
2 N-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
450m Ω @ 500mA, 4.5V
Vgs(th) (Max) @ Id
1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
50pF @ 10V
Gate Charge (Qg) (Max) @ Vgs
2.3nC @ 4.5V
Rise Time
8.5ns
Fall Time (Typ)
13 ns
Turn-Off Delay Time
17 ns
Continuous Drain Current (ID)
680mA
Threshold Voltage
800mV
Gate to Source Voltage (Vgs)
8V
Drain to Source Breakdown Voltage
25V
Dual Supply Voltage
25V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Nominal Vgs
800 mV
Height
1.1mm
Length
3mm
Width
1.7mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3,000
$0.16281
$0.48843
6,000
$0.15294
$0.91764
15,000
$0.14307
$2.14605
30,000
$0.13123
$3.9369
75,000
$0.12630
$9.4725
FDC6303N Product Details
FDC6303N Description
These dual N-Channel logic level enhancement mode field effect transistors are produced using a proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. This device has been designed especially for low voltage applications as a replacement for digital transistors in load switching applications. Since bias resistors are not required this one N-Channel FET can replace several digital transistors with different bias resistors like the IMHxA series.
FDC6303N Features
25 V, 0.68 A continuous, 2 A Peak
RDS(ON) = 0.6 |? @ VGS = 2.7 V
RDS(ON) = 0.45 |? @ VGS= 4.5 V
Very low level gate drive requirements allowing direct operation in 3V circuits. VGS(th) < 1.5 V
Gate-Source Zener for ESD ruggedness. >6kV Human Body Model
Replace multiple NPN digital transistors (IMHxA series) with one DMOS FET
FDC6303N Applications
This product is general usage and suitable for many different applications.