FDC6506P datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website
SOT-23
FDC6506P Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
SOT-23-6 Thin, TSOT-23-6
Number of Pins
6
Weight
36mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1999
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Resistance
170MOhm
Additional Feature
LOGIC LEVEL COMPATIBLE
Subcategory
Other Transistors
Voltage - Rated DC
-30V
Max Power Dissipation
960mW
Terminal Form
GULL WING
Current Rating
-1.8A
Number of Elements
2
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
960mW
Turn On Delay Time
7 ns
Power - Max
700mW
FET Type
2 P-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
170m Ω @ 1.8A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
190pF @ 15V
Gate Charge (Qg) (Max) @ Vgs
3.5nC @ 10V
Rise Time
8ns
Fall Time (Typ)
8 ns
Turn-Off Delay Time
14 ns
Continuous Drain Current (ID)
1.8A
Threshold Voltage
-1.8V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
-30V
Dual Supply Voltage
30V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Height
1.1mm
Length
3mm
Width
1.7mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$5.167680
$5.16768
10
$4.875170
$48.7517
100
$4.599217
$459.9217
500
$4.338884
$2169.442
1000
$4.093287
$4093.287
FDC6506P Product Details
FDC6506P Description
These P-Channel logic level MOSFETs are produced using ON Semiconductor's advanced PowerTrench process that has been especially tailored to minimize on-state resistance and yet maintain low gate charge for superior switching performance.
These devices have been designed to offer exceptional power dissipation in a very small footprint for applications where the bigger more expensive SO-8 and TSSOP-8 packages are impractical.
FDC6506P Features
Low gate charge (2.3nC typical)
Fast switching speed
ROHS3 Compliant
No SVHC
Lead Free
High performance trench technology for extremely low RDS(ON)
SuperSOTTM-6 package: small footprint (72% smaller than standard SO-8); low profile (1mm thick)