FDMA3027PZ datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website
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FDMA3027PZ Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
6-VDFN Exposed Pad
Number of Pins
6
Weight
40mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2006
Series
PowerTrench®
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Other Transistors
Max Power Dissipation
1.4W
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of Elements
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
1.4W
Case Connection
DRAIN
Turn On Delay Time
5.2 ns
Power - Max
700mW
FET Type
2 P-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
87m Ω @ 3.3A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
435pF @ 15V
Gate Charge (Qg) (Max) @ Vgs
10nC @ 10V
Rise Time
3ns
Drain to Source Voltage (Vdss)
30V
Fall Time (Typ)
11 ns
Turn-Off Delay Time
17 ns
Continuous Drain Current (ID)
3.3A
Threshold Voltage
-1.9V
Gate to Source Voltage (Vgs)
25V
Drain-source On Resistance-Max
0.087Ohm
Drain to Source Breakdown Voltage
-30V
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Feedback Cap-Max (Crss)
80 pF
Height
725μm
Length
2mm
Width
2mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3,000
$0.48510
$1.4553
6,000
$0.46085
$2.7651
15,000
$0.44352
$6.6528
FDMA3027PZ Product Details
FDMA3027PZ Description
This particular device is intended to serve as a gate driver for larger Mosfets and other dual switching applications in a single package. For the least amount of conduction losses, it has two separate P-Channel MOSFETs with low on-state resistance. The MicroFET 2x2 package is ideal for linear mode applications and has remarkable thermal performance given its size. To increase the ESD voltage level, a G-S zener has been installed.