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FDN306P

FDN306P

FDN306P

ON Semiconductor

FDN306P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDN306P Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3
Supplier Device Package SuperSOT-3
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2001
Series PowerTrench®
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
Resistance 40MOhm
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Voltage - Rated DC -12V
Technology MOSFET (Metal Oxide)
Current Rating -2.6A
Number of Elements 1
Voltage 12V
Power Dissipation-Max 500mW Ta
Element Configuration Single
Current 26A
Power Dissipation 500mW
Turn On Delay Time 11 ns
FET Type P-Channel
Rds On (Max) @ Id, Vgs 40mOhm @ 2.6A, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1138pF @ 6V
Current - Continuous Drain (Id) @ 25°C 2.6A Ta
Gate Charge (Qg) (Max) @ Vgs 17nC @ 4.5V
Rise Time 10ns
Drain to Source Voltage (Vdss) 12V
Drive Voltage (Max Rds On,Min Rds On) 1.8V 4.5V
Vgs (Max) ±8V
Fall Time (Typ) 10 ns
Turn-Off Delay Time 38 ns
Continuous Drain Current (ID) -2.6A
Threshold Voltage -600mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage -12V
Dual Supply Voltage -12V
Input Capacitance 1.138nF
Drain to Source Resistance 40mOhm
Rds On Max 40 mΩ
Nominal Vgs -600 mV
Height 940μm
Length 2.92mm
Width 1.4mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.16078 $0.48234
6,000 $0.15041 $0.90246
15,000 $0.14004 $2.1006
30,000 $0.13277 $3.9831
75,000 $0.13202 $9.9015
FDN306P Product Details

FDN306P Description


Fairchild's innovative low voltage PowerTrench technology is used in this FDN306P P-Channel 1.8V specified MOSFET. It's been designed with battery power management in mind.


FDN306P Features


?Quick switching time

?Extremely low RDs with high-performance trench technology (ON)

?In the same footprint, supersOTTM -3 has a lower RDs(ON) and a 30% higher power handling capability than sOT23.


FDN306P Applications


Battery administration

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Battery security

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