FDP2D3N10C datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
SOT-23
FDP2D3N10C Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
20 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
TO-220-3
Weight
1.8g
Operating Temperature
-55°C~175°C TJ
Series
PowerTrench®
Pbfree Code
yes
Part Status
Active
Technology
MOSFET (Metal Oxide)
Power Dissipation-Max
214W Tc
Element Configuration
Single
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
2.3m Ω @ 100A, 10V
Vgs(th) (Max) @ Id
4V @ 700μA
Input Capacitance (Ciss) (Max) @ Vds
11180pF @ 50V
Current - Continuous Drain (Id) @ 25°C
222A Tc
Gate Charge (Qg) (Max) @ Vgs
152nC @ 10V
Drain to Source Voltage (Vdss)
100V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
800
$3.71745
$2973.96
FDP2D3N10C Product Details
FDP2D3N10C IGBT Description
The FDP2D3N10C IGBT is widely used in solar inverters, EVs (electrical vehicles), and HVDC (high voltage, direct current) systems. This IGBT is able to hold a voltage of 1200 V at its Collector-Emitter junction. It also has a Gate-Emitter voltage to ensure situation status and the maximum Collector current would be 80 A @25 ℃.
FDP2D3N10C IGBT Features
High power density with Shielded gate technology
Max RDS(on) = 2.3 mΩ at VGS = 10 V, ID = 222 A
RoHS Compliant
Power Density & Shielded Gate
Low Vds spike internal snubber function.
Low Qrr/Trr
Low switching loss
Good EMI performance
Extremely Low Reverse Recovery Charge, Qrr
High Power and Current Handling Capability
100% UIL Tested
Soft recovery performance
High-Performance Trench Technology for Extremely Low RDS(on)