FDZ298N Description

FDZ298N combines Xiantong's advanced 2.5V dedicated PowerTritch process with state-of-the-art BGA packaging to minimize PCB space and RDS (on). This BGA MOSFET represents a breakthrough in packaging technology, enabling the device to combine excellent heat transfer characteristics, high current handling capacity, ultra-low package, low gate charge and low RDS (conduction).

FDZ298N  Features

? 6 A, 20 V RDS(ON) = 27 m? @ VGS = 4.5 V

 RDS(ON) = 39 m? @ VGS = 2.5 V

? Occupies only 2.25 mm2 of PCB area.

Less than 50% of the area of a SSOT-6

? Ultra-thin package: less than 0.80 mm height when

mounted to PCB

? Outstanding thermal transfer characteristics:

4 times better than SSOT-6

? Ultra-low Qg x RDS(ON) figure-of-merit

? High power and current handling capability.

FDZ298N   Applications

? Battery management

? Battery protection