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316-87-139-41-012101

316-87-139-41-012101

316-87-139-41-012101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled39 PositionsFemale Socket

SOT-23

316-87-139-41-012101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 316
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 39
Number of Rows 1
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 3A
Terminal Pitch 2.54mm
Insulation Height 0.354 9.00mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.126 3.20mm
Contact Finish - Post Tin
UL Flammability Code 94V-0
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
170 $3.10453 $527.7701
316-87-139-41-012101 Product Details

316-87-139-41-012101 Overview


It comes in a Socket package.The mounting type of the device is Through Hole.The product is packaged in a Bulk case.This is from the 316 Series.By Through Hole it's mounted.In this case, the device runs at -55°C~125°C Operating Temperature.

316-87-139-41-012101 Features


316 series

316-87-139-41-012101 Applications


There are a lot of Preci-Dip 316-87-139-41-012101 Rectangular Connectors applications.

  • Datacom
  • Instrumentation
  • Communication
  • Measuring & Control Technology
  • Military Technology
  • Medical technology
  • Telecommunications
  • Transportation
  • Embedded systems
  • Industrial Automation

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