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350-80-135-00-012101

350-80-135-00-012101

350-80-135-00-012101

Preci-Dip

350 Series 1-Row Header Solder Brass Bulk Through Hole Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 35-Position Board to Board 0.112 2.85mm Height

SOT-23

350-80-135-00-012101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Brass
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 350
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 35
Number of Rows 1
Voltage - Rated 150VDC
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Current Rating (Amps) 1A
Insulation Height 0.112 2.85mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.070 1.78mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Body Length or Diameter 2.466 inch
Contact Length - Post 0.163 4.15mm
Shrouding Unshrouded
Number Of PCB Rows 1
Contact Length - Mating 0.154 3.91mm
PCB Contact Pattern RECTANGULAR
Overall Contact Length 0.475 12.07mm
Mating Contact Pitch 0.07 inch
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
140 $3.87193 $542.0702
350-80-135-00-012101 Product Details

350-80-135-00-012101 Overview


Packaging is in the form of Header.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the 350 Series.There is a mounting hole at Through Hole.Devices operate at -55°C~125°C operating temperatures.

350-80-135-00-012101 Features


350 series


350-80-135-00-012101 Applications


There are a lot of Preci-Dip
350-80-135-00-012101 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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