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801-83-007-40-002191

801-83-007-40-002191

801-83-007-40-002191

Preci-Dip

1 RowsSocketSolderBeryllium CopperSurface Mount, Right AngleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled7 PositionsFemale Socket

SOT-23

801-83-007-40-002191 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 801
Feature Pick and Place
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 7
Number of Rows 1
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3A
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Finish - Post Tin
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,500 $0.63175 $0.63175
801-83-007-40-002191 Product Details

801-83-007-40-002191 Overview


The product is packaged in Socket.Surface Mount, Right Angle is the type of mounting for the device.Packaging the product involves using a Bulk case.A product of the 801 Series, it belongs to the range of products of that series.A number of features make the Pick and Place feature more powerful.Surface Mount mounts the part.In this case, the device runs at -55°C~125°C Operating Temperature.

801-83-007-40-002191 Features


801 series

801-83-007-40-002191 Applications


There are a lot of Preci-Dip 801-83-007-40-002191 Rectangular Connectors applications.

  • Measuring & Control Technology
  • Medical technology
  • Industrial Automation
  • Data Technology
  • Automotive Electronics
  • Datacom
  • Telecommunications
  • Military Technology
  • Embedded systems
  • Instrumentation

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